chip ferrite bead revision february 13, 2014 1 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb-h series socay electronics co., ltd. www.socay.com u monolithic inorganic material construction u closed magnetic circuit avoids crosstalk u smd type & suitable for reflow and wave soldering u available in various sizes u excellent solderability and heat resistance u high reliability u with a sharp and frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal filtering between analog and digital circuitry, clock generation circuitry, i/o interconnects, isolation between rf noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted rf energy from corrupting the power generation circuitry. sharp impedance characteristics can effectively minimize attenuation, high frequency emi prevention of lcd monitor, pda, computers, computer peripherals, cellular equipment, digital tv, digital cameras, audio/visual equipment, dvd, wireless communication devices, mp3. operating temperature range -40 ~ +125 o c storage condition less than 40 and 70% rh storage time 6 months(size:1005), 12 months(size:1608 above) soldering method reflow or wave soldering 1 series name 2 size code: the first two digitals : length(mm), the last two digitals : width(mm) 3 material code 4 impedance( ), 25% 5 fixed decimal point 6 rated current cod a=50ma b=80ma c=100ma d=150ma e=200ma f=300ma g=400ma h=500ma i=600ma j=700ma k=800ma 8 packaging: p - embossed paper tape, 7" reel t - embossed plastic tape, 7" reel 7 soldering : green parts: s - soldering lead-free f - lead-free for whole chip general technical data part numbering f eatures applications scgb 1608 h 12 1 e p f ( 1 ) ( 2 ) ( 3 ) ( 4 ) ( 5 ) ( 6 ) ( 7 ) ( 8 ) e.g.: 600=60 ? , 121=120 ?
chip ferrite bead revision february 13, 2014 2 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb-h series socay electronics co., ltd. www.socay.com scgb1005-h series part number impedance ( ) 25% test freq. (mhz) dcr ( ) (max.) rated current (ma) SCGB1005H750FPF 75 100 0.40 300 scgb1608-h series part number impedance ( ) 25% test freq. (mhz) dcr ( ) (max.) rated current (ma) scgb1608h200hpf 20 100 0.25 500 scgb1608h750hpf 75 100 0.35 500 scgb1608h800hpf 80 100 0.35 500 scgb1608h121epf 120 100 0.45 200 scgb1608h301epf 300 100 0.45 200 scgb1608h601epf 600 100 0.50 200 scgb1608h102epf 1000 100 0.60 200 scgb2012-h series part number impedance ( ) 25% test freq. (mhz) dcr ( ) (max.) rated current (ma) scgb2012h121epf 120 100 0.25 200 scgb2012h221epf 220 100 0.25 200 scgb2012h301epf 300 100 0.25 200 scgb2012h601epf 600 100 0.35 200 test level 250 mv test instruments l hp4291b rf impedance / material analyzer l hp4338a/b milliohm meter l agilent 8720es s-parameter network analyzer l hp6632b system dc power supply ** for special part number which is not shown in the above table, please refer to appendix. electrical ch aracteristics (continue)
chip ferrite bead revision february 13, 2014 3 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb-h series socay electronics co., ltd. www.socay.com for lead free solder unit: mm symbol 1005 (eia 0402) 1608 (eia 0603) 2012 (eia 0805) l 1.00 0.10 1.60 0.15 2.00 0.20 w 0.50 0.10 0.80 0.15 1.25 0.20 t 0.50 0.10 0.80 0.15 0.90 0.20 e 0.25 0.10 0.30 0.20 0.50 0.30 unit: mm size a b c 1005 0.40~0.60 1.60~2.60 0.40~0.70 1608 0.50~0.70 2.10~3.10 0.65~0.95 2012 1.00~1.20 3.00~4.00 0.80~1.10 construction & dimensions recommended soldering conditions 25 150 200 217 260 pre-heating soldering 60~120 second 30 second 60~150 second time (sec.) temperature () recommended pad layout l t e e w
chip ferrite bead revision february 13, 2014 4 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb-h series socay electronics co., ltd. www.socay.com symbol 1005 1608 2012 paper paper paper w 8.00 0.10 8.00 0.10 8.00 0.10 p 2.00 0.05 4.00 0.10 4.00 0.10 e 1.75 0.05 1.75 0.10 1.75 0.10 f 3.50 0.05 3.50 0.10 3.50 0.10 d 1.55 0.05 1.56 0.10 1.56 0.10 d1 na na na p 4.00 0.10 4.00 0.10 4.00 0.10 p 0 10 na na 40.0 0.20 p2 2.00 0.05 2.00 0.10 2.00 0.10 a0 0.62 0.03 1.05 0.05 1.50 0.05 b0 1.12 0.03 1.85 0.05 2.30 0.05 k0(t) 0.60 0.03 0.95 0.05 0.95 0.05 t na na na part size(eia size) packaging option quantity 1005 (0402) 7 reel 10,000 1608 (0603) 7 reel 4,000 2012 (0805) 7 reel 4,000 the contents of a box 1005 (0402): 6 reels / inner box 1608 (0603): 6 reels / inner box 2012 (0805): 6 reels / inner box tape specifications paper carrier unit: mm reel specifications & packaging
chip ferrite bead revision february 13, 2014 5 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb-h series socay electronics co., ltd. www.socay.com test item test condition criteria temperature cycle a. temperature : -40 ~ +85 b. cycle : 100 cycles c. dwell time : 30minutes measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value operational life a. temperature : 125 5 b. test time : 1000 hrs c. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value biased humidity a. temperature : 40 2 b. humidity : 90 ~ 95 % rh c. test time : 1000 hrs d. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value resistance to solder heat a. solder temperature : 260 5 b. flux : rosin c. dip time : 10 1 sec a. more than 95 % of terminal electrode should be covered with new solder b. no mechanical damage c. induction value should be within 20 % of the initial value adhesive test a. reflow temperature : 245 it shall be soldered on the substrate applying direction parallel to the substrate b. apply force(f) : 5 n test time : 10 sec a. no mechanical damage b. soldering the products on pcb after the pulling test force > 5 n rated current test a. apply current : full rated current / 5min temperature rise should be less than 25 steam aging test a. temperature : 93 b. test time : 4hrs others: 8hrs c. solder temperature : 235 5 d. flux : rosin e. dip time : 5 1 sec more than 95 % of terminal electrode should be covered with new solder reliability and test condition
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